Apple M1X chiplet marks the entry of the company into the era of Apple Silicon.
This new chiplet solves the memory scaling challenges and cores by using some advanced technology in packing.
This would include TSMC’s latest SoC integrated system and the 3D Fabric Technology.
The upcoming event on Apple will be focusing on the Mac.
Apart from this, we will also get to see the strategy taken by the company about the chipsets under Apple Silicon.
The company has plans to deploy them in the upcoming few years.
The graphics that Apple is going to introduce will be known to many Star War fans.
The moment is about a spacecraft making a jump to lightspeed.
The graphic will be a significant sign that the company wants to use across the entire industry when it comes to the performance of chips.
In this article, we will be focusing on how the company intends to carry forward with it.
Apple M1X chipset
The company’s M-series and A-series chips are the SoCs, also known as System On A Chip.
The very new SoCs include all the GPUs, CPUs, Memory, and Neural Engine, which will all be on the same piece of a silicon chip.
In the event, we might see that the company is jumping to the SoIC (System on Integrated Chips) type of semiconductor.
The new technology is called chiplets, and AMD is the first to develop it. AMD’s Ryzen 5000 series will be the first to feature it.
The technology of chiplets is the way towards our future. Apple will scale up the unified memory system on the M1 processor chips to fulfill the additional requirements of memory by the officials in the upcoming times.
This will also lead to a pathway of several more cores.
After introducing the Apple M1X chiplet, the company will be entering an era of Apple Silicon.
The manufacturers have been facing challenges in manufacturing smaller nodes. Hence, the entire industry is planning to shift towards the direction of chiplets.
The wafer fields also have an affinity towards the smaller chips.
AMD is right now leading the way ahead of its competitors Intel and Apple, in this technology.
As we will see that the Apple M1X chiplet gets doubled up in its design, the cores of CPU and GPU will also get doubled.
If someone places four chiplets of the M-series on a big package of SoIC, the processing power will be sufficient to run the Mac Pro towers.
In the future, we are sure that the Mac Pro will bring in the M2 chiplet package.
Further details on the Apple M1X chiplet
There were reports from some reliable sources which stated that the latest 14 inches and 16 inches MacBook Pro would be equipped with new chips.
These chips had been codenamed Jade C-Chop and Jade C-Die.
All of them will have ten cores- eight of these are high-performance ones, and the remaining two are energy-efficient ones.
The chips will come in variants of 16 and 32 GPU core variants, with the RAM going up to 64 GB.
TSMC has made plans to cut down half of the GPU cores to make the chiplet go even smaller.
These might also be the chips that the company had disposed of after disabling all the GPU cores.
To get a better quality of wafer yields, the smaller chips are always considered the superior ones.
All the wafers in the market have some chips which do not provide that good performance.
If there is any defect occurring on a bigger monolithic CPU chip, then it is said that a similar number and kinds of problems will be seen appearing on a wafer with many more small chips in quantity.
Details of the M2 chip coming on the Mac pro
The latest Mac Pro will become equipped with the new chips that have been dubbed as Jade 2C-Die and Jade 4C-Die. These will be having 20 and 40 variants of the core.
The numbers 2 and 4 in the name are making many people think about doubling or quadrupling the Apple M1X chiplet.
The performance difference in both the chips might be seen in the frequency of the chips.
The Mac Pro has a different type of thermals because the enclosure over here is quite large than the previous Mac computers.
Apple, however, has managed to bring up the clock frequency of the Apple M1X chiplet
Some explanations state that Jade 2C-Die and Jade 4C-Die might be designed on the TSMC process of sizes 4nm and 3nm.
The next Mac Pro will be coming in the next year, and hence there is a strong feeling that they will not come on the Apple M1X chiplet.
Rather they will be coming into the market equipped with the new M2 chiplets.
Working speed of the new chips
Apple Silicon will be entering an era of totally new chiplets.
The company seems to be following the way of AMD, and we will see that in some time, the entire industry will follow this path as well.
The Apple M1X chiplet, with its ten core CPU, 16 core GPU, and around 32 GB of combined memory, will be tremendously fast.
If we look at the new A-15 Bionic chip, we will see that it is much faster than the A-14 Bionic chip, although both are built on 5 nm cores.
The A-15 has been built by using the TSMC N5P node, and we can see that it has gained a higher performance than we had imagined.
We are sure that the Apple M1X chiplet will benefit from the TSMC N5P node compared to the M1.
The improvement in the performance will be by 25-30 percent more than the previous one.